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Center for Advanced Microelectronics Manufacturing


Research Summary

The Center for Advanced Microelectronics Manufacturing (CAMM) at Binghamton University (BU) is an R&D center dedicated to research on large-area flexible electronics, one of three nationally sponsored efforts in this area, and the only one devoted to exploiting large-area flexible electronics.  The CAMM was established in 2005, when the FlexTech Alliance (then, the US Display Consortium) selected BU to spearhead development of next-generation roll-to-roll (R2R) electronics manufacturing capabilities. Until now, most advanced electronics components have been produced on silicon or quartz wafers, or on plates of specialized glass in a ‘batch’ process that has been the backbone of the integrated circuit and flat panel display industries; however, the R2R process now allows components to be produced more efficiently, at higher yields and at a lower costs. Roll-to-Roll microelectronics manufacturing will be key to critical next-generation applications in a multitude of areas, including medical diagnostics and treatment, military and homeland security, flexible displays and electronics, computer and telecommunications, and consumer products.

USDC President and CEO Mike Ciesinski explained that the award was given to BU with the hopes of “enabling a university with an entrepreneurial spirit to collaborate with private industry in order to establish a center for next-generation electronics R&D and prototype manufacturing.” Binghamton University’s “demonstrated strengths in science and engineering and prior center management experience, as well as its partnering and leadership attributes” also factored largely in USDC’s decision to award the CAMM over $12M in tooling to help set up shop.

The CAMM’s official mission is to demonstrate the feasibility of R2R flexible electronics manufacturing by acquiring prototype tools and establishing processes capable of producing low-volume test bed products. The CAMM specializes in small-scale systems design, process development, prototyping, and manufacturing for academia and the microelectronics industry. The CAMM addresses fundamental enabling technologies and sciences associated with R2R manufacturing, as well as larger issues associated with system design (e.g., integration, performance, and manufacturing feasibility).

Part of what makes the CAMM so unique is their emphasis on collaboration. Not only is the CAMM itself a collaborative effort between BU, Endicott Interconnect Technologies Inc. and Cornell University, but the companies that join the CAMM remain involved throughout the entire R&D process. At CAMM, companies have an opportunity to share in leading-edge electronics manufacturing research and development. Full members participate on the CAMM Executive Advisory Board responsible for strategic planning and policy development, as well as the Technical Advisory Board that influences annual technical project planning.

As Director Bahgat Sammakia has pointed out, “The CAMM is a true partnership between government, academia and industry, which will provide Binghamton University the opportunity to perform unparalleled research in the area of flexible electronics and small-scale systems integration and packaging.”

Indeed, many collaborative projects have already been undertaken with companies such as Corning, General Electric, Samsung Electronics, and Analog Devices, who participate in the CAMM through paid membership fees and funded research programs. The US Army Research Laboratory and NASA are also collaborators. Excited about this young Center’s promising future, Daniel C. Gundersen, former Upstate Empire State Development Chairman said, “The intellectual capital at Binghamton University is being paired with government and industry to fuel Upstate New York's innovation economy, and it’s collaborations like this one that have great potential to spur economic growth statewide.” And according to BU President Lois B. DeFleur, CAMM’s unparalleled R&D capability “will help businesses compete in the global marketplace and spur economic advancement in the Southern Tier, New York State and the nation.”

Offering unique, state-of-the-art equipment to both the university community and private industry, the CAMM functions as an integral component of Binghamton University’s NYS Center of Excellence in Small-Scale Systems Integration and Packaging (S3IP).

The CAMM features a 10,000 sq. ft. facility with a clean room and a fully integrated $17M R2R prototype research line that includes an impressive lineup of tools: Azores High Precision Photolithography Aligner/Exposure Tool, CHA Industries High Vacuum Coater, Bobst High Vacuum Coater, Energy Conversion Devices ECD-IV In-line Defect Inspection Tool, Northfield Automation Web Handling Systems, Kraemer Koating Cleaning/Wet Process Tool, and a Hollmuller Sigmund Wet Stripper/Developer Tool.

Well equipped for success, the Center continues to grow as members contribute equipment.

Current Research Focus

A sample of current research projects underway includes the following:

• Large-scale R2R Manufacturing of Solar Cells;
• Real-time Data Capture Interface for Vision;
• Systems-based Defect Analysis in R2R Manufacturing;
• Process Characterization and Development – The Use of Diode Laser Soldering (DLS) or Selective Soldering on Flexible and Rigid Substrates;
• Comprehensive Process Optimization of Inkjet-printed Flexible Electronics and Photovoltaics;
• Materials and Processing in Inkjet Printing Fabrication of Polymer Thin-film Transistors and Sensors;
• Development of Flexible Sensor Arrays on Polymer Substrates – Breath Sensors for Monitoring Diabetes;
• Low-cost Flexible Nanocomposite Heterojunction Solar Cells by R2R Manufacturing; and
• Wide-area Transparent Thermoelectric Energy Generation.

Funding Sources

As a university-industry-government research center, the CAMM is funded by the federal and state governments, private industry, and Binghamton University. The Center encourages companies to use the facility for their own company-specific projects.

Contact Info

Bahgat Sammakia, Director
The Center for Advanced Microelectronics Manufacturing
Binghamton University
Binghamton, NY 13902-6000
(607) 777-5314